Article Article
Characteristics of Eddy Current Attenuation in Metal Clad Plates and Measurement of Cladding Thickness

A metal clad plate consists of a base layer and a clad layer of different materials. When testing clad plate using the eddy current (EC) method, the variation of EC density along the thickness direction in clad plate is complicated owing to the interface between the layers. This article attempts to investigate the characteristics of the variation of EC density in the thickness direction in clad plate based on finite element analysis. The results are then used for revealing the mechanism of the relation between coil voltage and the thickness of the clad layer which is essential for the measurement of cladding thickness. Thereupon, the experiment of measuring cladding thickness is performed, in which the testing frequency is selected based on the voltage-thickness relation. It turns out that the measurement is accurate and the results have good linearity.



K. S. Lee and Y. Kwon, Trans. Nonferrous Met. Soc. China 23, 341–346 (2013). DOI: 10.1016/S1003-6326(13)62467-X.

Y. Zhang et al., J. Alloys Compd. 821, 153249 (2020). DOI: 10.1016/j.jallcom.2019.153249.

S. Yun, C. Park, and I. Song, Int. J. Electr. Power Energy Syst. 44, 60–69 (2013). DOI: 10.1016/j.ijepes.2012.07.006.

N. Yusa and H. Hashizume, Nondestruct. Test. Eval. 32, 50–58 (2017). DOI: 10.1080/10589759.2015.1135918.

D. Rifai et al., Indian J. Sci. Technol. 9, 17485 (2016). DOI: 10.17485/ijst/2016/v9i9/88724.

K. B. Ali et al., IET Circ. Device. Syst. 11, 330–343 (2017).

L. Tian et al., Proc. IEEE Int. Instrum. Meas. Technol, Pisa, Italy, pp. 848–852 (2015)

Z. Mottl, NDT & E Int. 23, 11–18 (1990).

G. Mook, O. Hesse, and V. Uchanin, Mater. Test 49, 258–264 (2007). DOI: 10.3139/120.100810.

S. Jiao, X. Liu, and Z. Zeng, IEEE Trans. Magn. 53, 1–8 (2017). DOI: 10.1109/TMAG.2017.2669181.

Z. Zeng et al., Chin. J. Mech. Eng. 32, 106–114 (2019). DOI: 10.1186/s10033-019-0419-6.

C. Dodd and W. Deeds, J. Appl. Phys. 39, 2829–2838 (1968). DOI: 10.1063/1.1656680.

Z. Chen et al., Numerical Analysis Methods for Electromagnetic Nondestructive Evaluation (China Machine Press, Beijing, 2017), pp. 60–95

A. Kolyshkin and R. Vaillancourt, IEEE Tran. Magn. 33, 2473–2477 (1997). DOI: 10.1109/20.595900.

D. Zhang et al., Nondestruct. Test. Eva. 31, 191–208 (2015). DOI: 10.1080/10589759.2015.1081903.


Usage Shares
Total Views
3 Page Views
Total Shares
0 Tweets
0 PDF Downloads
0 Facebook Shares
Total Usage