Publication: Publication Date: 1 September 2020
Next Generation NDE Sensor Systems as IIoT Elements of Industry 4.0
Industry 4.0 (I4.0) describes the current revolution of the industrial world with a strong impact on the complete production sector. Data about production processes and the corresponding material and product status are the key elements. All over the world, the protagonists of I4.0 are facing the challenges to define appropriate concepts for I4.0 infrastructure, data exchange, communication interfaces and efficient procedures for the interaction of I4.0 elements. The role of future Nondestructive Evaluation (NDE4.0) and corresponding workflows (i.e. data generation and evaluation) will change accordingly. Thus, NDE4.0 systems will be elements of the Industrial Internet of Things (IIoT) that communicate with the production machines and devices. They become an integral part of the digital production world and the industrial data space. This paper is a summarized overview of our current developments as well as of general key technologies and future challenges to enable the paradigm change from classical NDT toward NDE4.0, starting with approaches on signal processing, artificial intelligence- based information generation and decision making, generic data formats and communication protocols. For illustration purposes, prototypical implementations of our work are presented. This includes a pilot development of a modern human machine-interaction by the use of assistance technologies for manual inspection.
DOI: https://doi.org/10.1080/09349847.2020.1841862
References
J. Vrana and R. Singh, arXiv: 2003.07773, preprint, Mar. 2020.
DIN SPEC 91345, 2016. Deutsche Institut für Normung e. V. (DIN).
B. G. W. Yee and J. C. Couchman, IEEE Trans. Sonics Ultrason. 23 (5), 299–305 (Oct. 1976). DOI:10.1109/T- SU.1976.30881.
M. Hubelbank, 1972 Ultrasonics Symposium, Boston, MA, pp. 22–24, 1972.
D. H. McSherry, IEEE Trans. Sonics Ultrason. 21 (2), 91–97 (Apr. 1974). DOI:10.1109/TSU.1974.29797.
R. Shankar and R. McDonough, IEEE International Conference on Acoustics, Speech, and Signal Processing, Tulsa, Oklahoma, pp. 533–537, 1978. DOI:10.1109/ICASSP.1978.1170415.
G. Demoment, R. Reynaud, and A. Herment, IEEE International Conference on Acoustics, Speech, and Signal Processing (ICASSP 84), San Diego, CA, pp. 504–507, 1984. DOI:10.1109/ICASSP.1984.1172500.
S.-K. Sin and C.-H. Chen, IEEE Trans. Image Process. 1, 3–10 (1992). DOI:10.1109/83.128026.
K. F. Kaaresen and E. Bolviken, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 46, 564–573 (1999). DOI:10.1109/58.764843.
E. J. Candès, J. Romberg, and T. Tao, IEEE Trans. Inf. Theory 52, 489–509 (2006). DOI:10.1109/TIT.2005.862083.
E. Mor, A. Azoulay, and M. Aladjem, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 57, 1996–2004 (2010). DOI:10.1109/TUFFC.2010.1647.
F. Boßmann et al., J. Nondestr. Eval. 31 (3), 225–244 (2012). DOI:10.1007/s10921-012-0138-8.
Y. Lu, R. Demirli, and J. Saniie, IEEE International Ultrasonics Symposium, Prague, Czech Republic, pp. 966–969, July 2013. DOI:10.1109/ULTSYM.2013.0248.
J. P. Fortineau et al., Ultrasonics 73, 253–261 (2017). DOI: 10.1016/j.ultras.2016.09.010.
H. Wu et al., Meas. Sci. Technol. 26 (10), 105401 (2015). DOI: 10.1088/0957-0233/26/10/105401.
G. David et al., J. Acoust. Soc. Am. 137 DIN SPEC 91345, 2016137 (5), 2773–2784 (2015). DOI:10.1121/1.4919302.
A. Besson et al., IEEE Trans. Ultrason. Ferroelectr. Freq. Control 63, 2092–2106 (2016). DOI:10.1109/TUFFC.2016.2614996.
J. Shen and E. S. Ebbini, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 43 (1), 131–140 (Jan. 1996). DOI:10.1109/58.484472.
A. Austeng and S. Holm, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 49 (8), 1073–1086 (Aug. 2002). DOI:10.1109/TUFFC.2002.1026019.
M. Cetin et al., 2006 IEEE International Conference on Acoustics Speech and Signal Processing Proceedings, Toulouse, 2006. DOI:10.1109/ICASSP.2006.1660286.
B. Diarra et al., IEEE Trans. Biomed. Eng. 60 (11), 3093–3102 (Nov. 2013). DOI:10.1109/TBME.2013.2267742.
R. Rajamäki and V. Koivunen, IEEE Signal Process. Lett. 25 (12), 1820–1824 (Dec. 2018). DOI:10.1109/LSP.2018.2876066.
T. Chernyakova and Y. Eldar, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 61, 1252–1267 (2014). DOI:10.1109/TUFFC.2014.3032.
H. Liebgott, R. Prost, and D. Friboulet, Ultrasonics 53 (2), 525–533 (2013). DOI:10.1016/j.ultras.2012.09.008.
P. Kruizinga et al., Sci. Adv. 3 (12), e1701423 (2017). DOI: 10.1126/sciadv.1701423.
M. F. Schiffner and G. Schmitz, J. Acoust. Soc. Am. 141 (5), 3611 (2017). DOI:10.1121/1.4987735.
T. Di Ianni et al., IEEE Trans. Ultrason. Ferroelectr. Freq. Control 62, 1373–1383 (2015). DOI:10.1109/TUFFC.2014.006925.
J. B. Harley, Proceedings of the IEEE, vol. 104, pp. 1604–1619, Aug. 2016. DOI:10.1109/JPROC.2015.2481438.
D. James, PhD thesis, G.-August- Universität Göttingen, 2017. DOI:11858/00-1735-0000-0023-3DBE-D.
S. Sabeti and J. B. Harley, Mech. Syst. Signal Process. 140 (2020).
J. Lee, B. Bagheri, and H.-A. Kao, Manuf. Lett. 3, 18–23 (2015). DOI: 10.1016/j.mfglet.2014.12.001.
M. Vetterli, P. Marziliano, and T. Blu, IEEE Trans. Signal Process. 50, 1417–1428 (2002). DOI:10.1109/TSP.2002.1003065.
M. F. Duarte et al., IEEE Signal Process. Mag. 25 (2), 83–91 (Mar. 2008). DOI:10.1109/MSP.2007.914730.
R. Fergus, A. Torralba, and W. T. Freeman, Technical Report MIT-CSAIL-TR-2006-058, Cambridge, MA, 2006. DOI:1721.1/33962.
A. Stern and B. Javidi, IEEE/OSA J. Display Technol. 3 (3), 316–320 (Sep. 2007). DOI:10.1109/JDT.2007.900919.
M. Dakhah, M. J. Deen, and S. Shirani, Sensors 2013 (4), 4961–4978 (2013). DOI:10.3390/s130404961.
M. Lustig et al., IEEE Signal Process. Mag. 25 (2), 72–82 (2008). DOI:10.1109/MSP.2007.914728.
E. Y. Sidky et al., Med. Phys. 38 (7), S117–S125 (2011). DOI:10.1118/1.3560887.
F. Römer et al., Proceedings of the 25th European Signal Processing Conference (EUSIPCO-2017), Kos, Greece, Aug. 2017. DOI:10.23919/EUSIPCO.2017.8081631.
S. W. Doebling et al., Los Alamos National Laboratory report LA-13070-MS, 1996. DOI:10.2172/249299.
C. R. Farrar and K. Worden, Philos. Trans. R. Soc. A Math. Phys. Eng. Sci. 365 (1851), 303–315 (2007). DOI:10.1098/rsta.2006.1928.
J. Bercoff, Ultrasound Imaging - Med. Appl. 3–24 (2011). DOI:10.5772/19729.
E. Perez et al., Proceedings of the 2019 IEEE International Ultrasonics Symposium, Glasgow, UK, Oct. 2019. DOI:10.1109/ULTSYM.2019.8926040.
S. Semper et al., Proceedings of the 27th European Signal Processing Conference (EUSIPCO-2019), A Coruna, Spain, Sep. 2019. DOI:10.23919/EUSIPCO.2019.8903133.
I. G. Kazantsev et al., Signal Process. 82 (5), 791–801 (2002). DOI:10.1016/S0165-1684(02)00158-5.
Y. Sun et al., NDT E Int. 38 (7), 522–528 (2005). DOI:10.1016/j.ndteint.2005.01.011.
T. Wenzel and R. Hanke, Anglo- German Conference on NDT Imaging and Signal Processing, Oxford, Mar. 1998.
K. He et al., 2016 IEEE Conference on Computer Vision and Pattern Recognition (CVPR), Las Vegas, USA, pp. 770–778, 2016.
R. Girshick, 2017 IEEE International Conference on Computer Vision (ICCV), Venice, Italy, pp. 1440–1448, 2017.
N. J. Shipway et al., NDT E Int. 101, 113–123 (2019). DOI: 10.1016/j.ndteint.2018.10.008.
A. Osman et al., International Symposium on Ultrasound in the Control of Industrial Processes, Madrid, Spain, Apr. 2012.
A. Osman, V. Kaftandjian, and U. Hassler, J. Electron. Imaging SPIE 21 (2), 021111 (7 May 2012). DOI:10.1117/1.JEI.21.2.021111.
A. Krizhevsky, I. Sutskever, and G. E. Hinton, Commun. ACM 60 (6), 84–90 (2017). DOI:10.1145/3065386.
M. Meng et al., Neurocomputing 257, 128–135 (2017). DOI: 10.1016/j.neucom.2016.11.066.
N. Munir et al., Ultrasonics 94, 74–81 (2019). DOI: 10.1016/j.ultras.2018.12.001.
S. Dorafshan, R. J. Thomas, and M. Maguire, Constr. Build. Mater. 186, 1031–1045 (2018). DOI: 10.1016/j.conbuildmat.2018.08.011.
Z. Tong, J. Gao, and Z. Zhang, Constr. Build. Mater. 169, 69–82 (2018). DOI: 10.1016/j.conbuildmat.2018.02.081.
P. Zhu et al., NDT E Int. 101, 104–112 (2019). DOI: 10.1016/j.ndteint.2018.09.010.
C. Hu et al., Infrared Phys. Technol. 102, 103032 (2019). DOI: 10.1016/j.infrared.2019.103032.
I. J. Goodfellow, J. Shlens, and C. Szegedy, 3rd International Conference on Learning Representations, ICLR 2015, San Diego, CA, May 2015.
S. Bach et al., PLoS One 10 (7) (2015).
Z. Wei, D. Gross, and A. Osman, Far-East NDT conference, Qingdao, 2019. Paper to appear in IEEE proceedings in 2020.
D. Gross et al. Qualitaet und Zuverlaessigkeit QZ-Online, Carl Hanser Verlag, Deutsche Gesellschaft für Qualitaet e.V, Jahrgang 64, vol. 7, pp. 58–60, 2019.
J. Vrana:, Mater. Eval. 78 (7), 835–851 (Jul. 2020). DOI:10.32548/2020.me-04131. International Electrochemical Commission, IEC 62264 (Part 1-6), 2013–2016.
International Electrochemical Commission, IEC 62890 ED1, 2016.
American Society for Testing and Materials International, ASTM E2339, 2015. DOI:10.1520/E2339-15
International Organization for Standardization (ISO), International standard ISO 12052:2006 (E), 2006
American Society for Testing and Materials International, ASTM E2663 (2018). DOI:10.1520/E2663-14.
American Society for Testing and Materials International, ASTM E2699 (2018). DOI:10.1520/E2699-13.
American Society for Testing and Materials International, ASTM E2767 (2018). DOI:10.1520/E2767-13.
American Society for Testing and Materials International, ASTM E2767 (2018). DOI:10.1520/E2767-13.
American Society for Testing and Materials International, ASTM E2934 (2018). DOI: 10.1520/E2934-14.
Open Platform Communcications Foundation, OPC Unified Architecture - Interoperabilität für Industrie 4.0 und das Internet der Dinge, Verl: OPC Foundation, OPC Foundation, 2018.
International Electrotechnical Commission, IEC 62541, 2010–2018.
F. Krieg et al., Insight – J. Br. Ins. Non-Destr. Test. 61 (11) 663–669 (Nov. 2019). DOI:10.1784/insi.2019.61.11.663.
F. Krieg et al., Proceedings of the 2019 IEEE International Ultrasonics Symposium (IUS), Glasgow, UK, Oct. 2019.
J. Schemmel et al., 2010 IEEE International Symposium on Circuits and Systems (ISCAS), Paris, pp. 1947–1950, 2010.
A. Wilde and M. Eiber, Fabriksoftware 4, 60–63 (Nov. 2018). GITO Verlag, ISSN 2569-7962.
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