Article Article
Developing a Speckle Pattern to Evaluate Adhesive Joints Using Digital Image Correlation

Digital Image Correlation (DIC) is a known Non-Destructive Evaluation (NDE) method used in various industries. DIC requires a randomly produced pattern, known as speckle pattern, to track and generate strain maps. The speckle patterns are fundamental for DIC applications. DIC uses images of these speckle patterns before and after a load has been applied to generate strain maps by comparing the changes between speckle pattern images. In this study, a speckle pattern is sought to implement within adhesive joints. The speckle pattern must be trackable using ultrasonic imaging; therefore, it is chosen from materials with high acoustic impedance metals. By tracking the speckle pattern and using DIC, defects within joints will be revealed. This allows non-destructive analysis to be conducted on adhesive joints to detect defects which may go undetected using conventional ultrasonic techniques.

DOI: doi.org/10.1080/09349847.2019.1645253

References

R. C. Waugh, J. M. Dulieu-Barton, and S. Quinn, Adv. Exp. Mech. viii (70), 369–374 (2011).

C. Jeenjitkaew, Z. Luklinska, and F. Guild, Int. J. Adhes. Adhes. 7 (30), 643–653 (2010). DOI: 10.1016/j.ijadhadh.2010.06.005.

P. N. Marty, N. Desai, and J. Anderson, Proc. 16th WCNDT, www.ndt.net (2004).

C. C. H. Guyott, P. Cawley, and R. D. Adams, J. Adhes. 2 (20), 129–159 (1986). DOI: 10.1080/00218468608074943.

J. K. Chambers and J. R. Tucker, Insight 3 (41), 151–155 (1999).

P. B. Nagy, J. Adhes. Sci. Technol. 8 (5), 619–630 (1991). DOI: 10.1163/156856191X00521.

A. E. Bogdanovich and I. Kizhakkethara, Composites Part B. 6 (30), 537–551 (1999). DOI: 10.1016/S1359-8368(99)00026-8.

R. D. Adams, P. Cawley, and C. C. H. Guyott, J. Adhes. 3–4 (21), 279–290 (1987). DOI: 10.1080/00218468708074975.

C. J. Brotherhood, B. W. Drinkwater, and S. Dixon, Ultrasonics 7 (41), 521–529 (2003). DOI: 10.1016/S0041-624X(03)00156-2.

T. C. Chu et al., Exp Mech 3 (25), 232–244 (1985). DOI: 10.1007/BF02325092.

B. Kamsu-Foguem, Adv. Eng. Inform. 4 (26), 859–869 (2012). DOI: 10.1016/j.aei.2012.06.006.

C. J. Brotherhood, B. W. Drinkwater, and F. J. Guild, Nondestr. Eval. 21 (3), 95–104 (2002). DOI: 10.1023/A:1022584822730.

E. Tsangouri, G. Karaiskos, D. G. Aggelis, D. Van Hemelrijk, and A. Deraemaeker (2014, June). Healing Performance on Concrete under Mode I Fracture by Ultrasonic Testing Using Embedded Transducers, acoustic emission and digital image correlation method 9th Int. In 9th Int. Conf. on Structural Dynamics (EURODYN 2014), Porto, Portugal.

D. E. A. Kinet, Sensors 4 (14), 7394–7419 (2014). DOI: 10.3390/s140407394.

M. A. Sutton et al., Image. Vis. Comput. 3 (4), 143–150 (1986). DOI: 10.1016/0262-8856(86)90057-0.

Z. L. Kahn-Jetter and T. C. Chu, Exp. Mech. 1 (30), 10–16 (1990). DOI: 10.1007/BF02322695.

B. K. Bay et al., Exp. Mech. 3 (39), 217–226 (1999). DOI: 10.1007/BF02323555.

P. F. Luo et al., Exp. Mech. 2 (32), 123–132 (1993). DOI: 10.1007/BF02322488.

R. L. V. Kumar, M. R. Bhat, and C. R. L. Murthy, Int. J. Adhes. Adhes. 47, 60–68 (2013). DOI: 10.1016/j.ijadhadh.2013.01.004.

T. Chu, A. Mahajan, and C. T. Liu, Exp. Tech. 6 (26), 25–28 (2002). DOI: 10.1111/j.1747-1567.2002.tb00087.x.

B. E. A. Regez, Struct. Eng. Mech. 1 (29), 113 (2008). DOI: 10.12989/sem.2008.29.1.113.

M. A. Hamed, and T. C. Chu (1985). Ultrasonic displacement measurements using digital correlation. In: 1985 SEM Spring Conference on Experimental Mechanics, Las Vegas, NV, June 9-14, 1985, Proceedings (A86-34601 15-39). Brookfield Center, CT, Society for Experimental Mechanics, Inc., 1985, p. 819-822. (pp. 819-822).

A. A. Hassen, A. Poudel, T. P. Chu, M. Yester, and U. K. Vaidya (2014, October).

Tracing defects in glass fiber/polypropylene composites using ultrasonic c-scan and Xray computed tomography methods. In ASNT Annual Conference 2014 (pp. 72-79). Charleston, SC

N. R. Center, “Acoustic Impedance,” Available: www.nde-ed.org., 2016.

J. M. Arenas, J. J. Narbón, and C. Alía., Int. J. Adhes. Adhes. 30 (3), 160–165 (2010). DOI: 10.1016/j.ijadhadh.2009.12.003.

K. Bak, and M. Dinesh, “Effect of adhesive thickness area of single lap joints in composite laminate using acoustic emission technique and fea,” Insight, 55, No. 01 (2013).

ASTM D 3163 Standard.

G. Stoilov, V. Kavardzhikov, and D. Pashkouleva, J. Theor. Appl.Mech. 42 (2), 55–66 (2012). DOI: 10.2478/v10254-012-0008-x.

C. Lane, R. L. Burguete, and A. Shterenlikht (2008, June). An objective criterion for the selection of an optimum dic pattern and subset size. In Proceedings of the XIth international congress and exposition (pp. 1-9). Orlando, Florida, USA

S. K. Nash-Stevenson, G. Karr, L. M. Freeman, and J. Bland (2004). The 2003 NASA Faculty Fellowship Program Research Reports.

J. Blaber, B. Adair, and A. Antoniou, Exp. Mech. 55 (6), 1105–1122 (2015). DOI: 10.1007/s11340-015-0009-1.

Metrics
Usage Shares
Total Views
12 Page Views
Total Shares
0 Tweets
12
0 PDF Downloads
0
0 Facebook Shares
Total Usage
12