Publication: Publication Date: 1 October 2018Testing Method:
Effect of Structural Parameters on Coupling Interference of Arrayed Eddy Current Testing
Eddy current testing is a nondestructive testing technique that works based on the electromagnetic induction principle. It has been widely applied in the fields of crack detection, displacement measurement, and many others because it is noncontact, nonpolluting, and robust (George et al. 2017; Johnston et al. 2018; Sakthivel et al. 2016; Li et al. 2016a; Deng et al. 2018). In order to achieve higher efficiency and better performance, arrayed eddy current testing (AECT), based on the eddy current technique, has received more and more attention (Chen et al. 2018; Bouloudenine et al. 2017; Li et al. 2016b; Postolache et al. 2013; Xie et al. 2015). In the AECT application, multiple coils are energized to generate the magnetic field, so coupling inter-ference between coils is inevitable (Sheng et al. 2016). Moreover, the coil mutual inductance can be regarded as the parameter reflection of coupling interference (Chao et al. 2016). Thus, the study of the relationship between structural parameters and coil mutual inductance is useful. This study can reveal the relationship between structural parameters and coupling interference, and then optimize the arrayed structural parameters to achieve better testing performance. In this paper, the effect of structural parameters on the coupling interfer-ence of AECT is analyzed. Due to the good symmetry of the positive polygon arrangement, it will be adopted as the configuration of arrayed coils. A theo-retical analysis model is established, and the constraint relationship between parameters is also analyzed. In addition, simulation and experimental verifi-cation is carried out. According to the results, when the coil thickness is larger or the topological radius is smaller, the intensity of coupling interference using AECT is greater. Thus, arrayed coils with smaller thicknesses and larger topological radii are more suitable for AECT applications.
References
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