With the miniaturization of the electronic components, the advanced embedded equipment's have multiplied their computing power. This gain in speed has allowed new acquisition algorithm and new post-processing imaging treatment. New techniques like FMC/TFM, are now getting more popular and more accessible than ever. Like the Phased-Array technique at his beginning, these advanced imaging techniques are not yet recognized by standards but surely have benefits. Even if they can’t be used alone for detection or rejection, it can be a big help in the case of defects characterization. In this paper, we will demonstrate that the combination of Phased Array and advanced imaging techniques can improve the defects characterization process for many applications.

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