High-Frequency Contact Ultrasound for Subsurface Characterization of Microelectronics

This paper describes development of a prototype system for characterizing subsurface features in microelectronic components using direct-contact high-frequency pulse-echo ultrasound. Of particular interest are components which may have been recycled and thus contain delaminations from the desoldering operation.

Metrics
Usage Shares
Total Views
6 Page Views
Total Shares
0 Tweets
6
0 PDF Downloads
0
0 Facebook Shares
Total Usage
6