Ultrasonic Analysis of the Degree of Cure and Cohesive Properties of the Adhesive in a Bond Joint

Acoustic techniques have been used to monitor cure of thermoset adhesive during cure reaction and to evaluate cohesive properties of the material in the adhesive joint after cure. Longitudinal sound velocity and attenuation as well as adhesive’s elastic moduli were monitored to investigate molecular network development during reaction at different temperatures. The ability of high-resolution acoustic microscopy to study development of adhesive microstructure during cure reactions was also demonstrated. Correlations of the value of sound velocity with cohesive properties of the material and with joint performance were demonstrated. This approach can be used to monitor development of the cohesive strength of the joint during the cure process in manufacturing.

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