The modulus of elasticity and the strength of lead-free solder are key material properties that need to be measured accurately in order to facilitate design, ensure reliability and promote compliance with legislative restrictions on hazardous substances. Because the most widely used lead-free solders which are based on tin (Sn) – silver (Ag) eutectics are used at high homologous temperatures (room temperature corresponds to 61% of the melting point and 100 °C to 75% of the melting point) it is likely that non-linear elastic behavior may be observed. Thus, the elastic constants will vary with temperature. This paper explores the applicability of a non-linear elastic relationship, previously shown to be valid for other materials, to predict the elastic modulus as a function of temperature for lead-free solders.

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