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Method of In Situ Thickness Measurement of Sputtering Target Bonded Assemblies Using the Bubbler Technique

The only way to control the thickness variation in bonded assemblies is to measure it. The conventional technique for thickness measurements of bonded assemblies is the ultrasonic pulse/echo method, which allows us to get the precise timing information for the echo bounced back from the bond interface. If the thickness gage is calibrated to the speed of sound in the test material, then the thickness can be determined in a relatively simple manner.

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